Polymer Composition for Use in an Antenna System

ABSTRACT

A polymer composition comprising a dielectric material distributed within a polymer matrix is provided. The dielectric material has a volume resistivity of from about 0.1 ohm-cm to about 1 × 10 12  ohm-cm. wherein the polymer matrix contains at least one thermotropic liquid crystalline polymer, and further wherein the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims filing benefit of U.S. Provisional Pat. Application Serial No. 62/889,792 having a filing date of Aug. 21, 2019; U.S. Provisional Pat. Application Serial No. 62/898,188 having a filing date of Sep. 10, 2019; U.S. Provisional Pat. Application Serial No. 62/925,271 having a filing date of Oct. 24, 2019; U.S. Provisional Pat. Application Serial No. 62/951,033 having a filing date of Dec. 20, 2019; U.S. Provisional Pat. Application Serial No. 62/958,003 having a filing date of Jan. 7, 2020; U.S. Provisional Pat. Application Serial No. 62/972,201 having a filing date of Feb. 10, 2020; U.S. Provisional Pat. Application Serial No. 63/024,579 having a filing date of May 14, 2020; and U.S. Provisional Application Serial No. 63/038,980 having a filing date of Jun. 15, 2020, which are incorporated herein by reference in their entirety.

BACKGROUND OF THE INVENTION

To form an antenna system in various electronic components, molded interconnect devices (“MID”) often contain a plastic substrate on which is formed conductive elements or pathways. Such MID devices are thus three-dimensional molded parts having an integrated printed conductor or circuit layout. It is becoming increasingly popular to form MIDs using a laser direct structuring (“LDS”) process during which a computer-controlled laser beam travels over the plastic substrate to activate its surface at locations where the conductive path is to be situated. With a laser direct structuring process, it is possible to obtain conductive element widths and spacings of 150 microns or less. As a result, MIDs formed from this process save space and weight in the end-use applications. Another advantage of laser direct structuring is its flexibility. Various materials have been proposed for forming the plastic substrate of a laser direct structured-MID device. For example, one such material is a blend of polycarbonate, acrylonitrile butadiene styrene (“ABS”), copper chromium oxide spinel, and a bisphenol A diphenyl phosphate (“BPADP”) flame retardant. One problem with such materials, however, is that the flame retardant tends to adversely impact the mechanical properties (e.g., deformation temperature under load) of the composition, which makes it difficult to use in laser direct structuring processes. Such materials are also unsuitable for lead free soldering processes (surface mount technology) that require high temperature resistance. Another problem is that the materials tend to have a low dielectric constant and high dissipation factor, which makes it difficult to use them in applications where it is desired to include more than one antenna in the device.

As such, a need exists for a polymer composition for use in an antenna system that has a relatively high dielectric constant and low dissipation factor.

SUMMARY OF THE INVENTION

In accordance with one embodiment of the present invention, a polymer composition is disclosed that comprises a dielectric material distributed within a polymer matrix. The dielectric material has a volume resistivity of from about 0.1 ohm-cm to about 1 × 10¹² ohm-cm. The polymer matrix contains at least one thermotropic liquid crystalline polymer, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.

Other features and aspects of the present invention are set forth in greater detail below.

BRIEF DESCRIPTION OF THE FIGURES

A full and enabling disclosure of the present invention, including the best mode thereof to one skilled in the art, is set forth more particularly in the remainder of the specification, including reference to the accompanying figures, in which:

FIGS. 1-2 are respective front and rear perspective views of one embodiment of an electronic component that can employ an antenna system;

FIG. 3 is a top view of an illustrative inverted-F antenna resonating element for one embodiment of an antenna system;

FIG. 4 is a top view of an illustrative monopole antenna resonating element for one embodiment of an antenna system;

FIG. 5 is a top view of an illustrative slot antenna resonating element for one embodiment of an antenna system;

FIG. 6 is a top view of an illustrative patch antenna resonating element for one embodiment of an antenna system;

FIG. 7 is a top view of an illustrative multibranch inverted-F antenna resonating element for one embodiment of an antenna system;

FIG. 8 depicts a 5G antenna system including a base station, one or more relay stations, one or more user computing devices, one or more or more Wi-Fi repeaters according to aspects of the present disclosure;

FIG. 9A illustrates a top-down view of an example user computing device including 5G antennas according to aspects of the present disclosure;

FIG. 9B illustrates a side elevation view of the example user computing device of FIG. 9A including 5G antennas according to aspects of the present disclosure;

FIG. 10 illustrates an enlarged view of a portion of the user computing device of FIG. 9A;

FIG. 11 illustrates a side elevation view of co-planar waveguide antenna array configuration according to aspects of the present disclosure;

FIG. 12A illustrates an antenna array for massive multiple-in-multiple-out configurations according to aspects of the present disclosure;

FIG. 12B illustrates an antenna array formed with laser direct structuring according to aspects of the present disclosure;

FIG. 12C illustrates an example antenna configuration according to aspects of the present disclosure; and

FIGS. 13A through 13C depict simplified sequential diagrams of a laser direct structuring manufacturing process that can be used to form an antenna system.

DETAILED DESCRIPTION

It is to be understood by one of ordinary skill in the art that the present discussion is a description of exemplary embodiments only, and is not intended as limiting the broader aspects of the present invention.

Generally speaking, the present invention is directed to a polymer composition that contains a dielectric material distributed within a polymer matrix that includes a thermotropic liquid crystalline polymer. By selectively controlling various aspects of the composition (e.g., volume resistivity of the dielectric material), the present inventor has discovered that the resulting composition is able to maintain a unique combination of a high dielectric constant and low dissipation for use in an antenna system. For example, the polymer composition may exhibit a high dielectric constant of about 4 or more, in some embodiments about 8 or more, in some embodiments about 10 or more, in some embodiments from about 10 to about 30, in some embodiments from about 11 to about 25, and in some embodiments, from about 12 to about 24, as determined by the split post resonator method at a frequency of 2 GHz. Such a high dielectric constant can facilitate the ability to form a thin substrate and also allow multiple conductive elements (e.g., antennae) to be employed that operate simultaneously with only a minimal level of electrical interference. The dissipation factor, a measure of the loss rate of energy, may also be relatively low, such as about 0.3 or less, in some embodiments about 0.1 or less, in some embodiments about 0.06 or less, in some embodiments about 0.04 or less, in some embodiments about 0.01 or less, and in some embodiments, from about 0.001 to about 0.006, as determined by the split post resonator method at a frequency of 2 GHz. Notably, the present inventor has also surprisingly discovered that the dielectric constant and dissipation factor can be maintained within the ranges noted above even when exposed to various temperatures, such as a temperature of from about -30° C. to about 100° C. For example, when subjected to a heat cycle test as described herein, the ratio of the dielectric constant after heat cycling to the initial dielectric constant may be about 0.8 or more, in some embodiments about 0.9 or more, and in some embodiments, from about 0.91 to about 1. Likewise, the ratio of the dissipation after being exposed to the high temperature to the initial dissipation factor may be about 1.3 or less, in some embodiments about 1.2 or less, in some embodiments about 1.1 or less, in some embodiments about 1.0 or less, in some embodiments about 0.95 or less, in some embodiments from about 0.1 to about 0.9, and in some embodiments, from about 0.2 to about 0.8. The change in dissipation factor (i.e., the initial dissipation factor - the dissipation factor after heat cycling) may also range from about -0.1 to about 0.1, in some embodiments from about -0.05 to about 0.01, and in some embodiments, from about -0.001 to 0.

Conventionally, it was believed that polymer compositions that possess the combination of a high dielectric constant and low dissipation factor would not also possess sufficiently good thermal, mechanical properties and ease in processing (i.e., low viscosity) to enable their use in certain types of applications. Contrary to conventional thought, however, the polymer composition has been found to possess both excellent thermal, mechanical properties and processability. The melting temperature of the composition may, for instance, be from about 250° C. to about 440° C., in some embodiments from about 270° C. to about 400° C., and in some embodiments, from about 300° C. to about 380° C. Even at such melting temperatures, the ratio of the deflection temperature under load (“DTUL”), a measure of short term heat resistance, to the melting temperature may still remain relatively high. For example, the ratio may range from about 0.5 to about 1.00, in some embodiments from about 0.6 to about 0.95, and in some embodiments, from about 0.65 to about 0.85. The specific DTUL values may, for instance, range from about 200° C. to about 350° C., in some embodiments from about 210° C. to about 320° C., and in some embodiments, from about 230° C. to about 290° C. Such high DTUL values can, among other things, allow the use of high speed and reliable surface mounting processes for mating the structure with other components of the electrical component.

The polymer composition may also possess a high impact strength, which is useful when forming thin substrates. The composition may, for instance, possess a Charpy notched impact strength of about 0.5 kJ/m² or more, in some embodiments from about 1 to about 60 kJ/m², in some embodiments from about 5 to about 50 kJ/m², and in some embodiments, from about 20 to about 45 kJ/m², as determined at a temperature of 23° C. in accordance with ISO Test No. ISO 179-1:2010. The tensile and flexural mechanical properties of the composition may also be good. For example, the polymer composition may exhibit a tensile strength of from about 20 to about 500 MPa, in some embodiments from about 50 to about 400 MPa, and in some embodiments, from about 70 to about 350 MPa; a tensile break strain of about 0.4% or more, in some embodiments from about 0.5% to about 10%, and in some embodiments, from about 0.6% to about 3.5%; and/or a tensile modulus of from about 5,000 MPa o about 20,000 MPa, in some embodiments from about 8,000 MPa to about 20,000 MPa, and in some embodiments, from about 10,000 MPa to about 20,000 MPa. The tensile properties may be determined at a temperature of 23° C. in accordance with ISO Test No. 527:2012. The polymer composition may also exhibit a flexural strength of from about 20 to about 500 MPa, in some embodiments from about 50 to about 400 MPa, and in some embodiments, from about 100 to about 350 MPa; a flexural elongation of about 0.4% or more, in some embodiments from about 0.5% to about 10%, and in some embodiments, from about 0.6% to about 3.5%; and/or a flexural modulus of from about 5,000 MPa o about 20,000 MPa, in some embodiments from about 8,000 MPa to about 20,000 MPa, and in some embodiments, from about 10,000 MPa to about 15,000 MPa. The flexural properties may be determined at a temperature of 23° C. in accordance with 178:2010.

Various embodiments of the present invention will now be described in more detail.

I. Polymer Composition A. Polymer Matrix

The polymer matrix contains one or more liquid crystalline polymers, generally in an amount of from about 15 wt.% to about 85 wt.%, in some embodiments from about 20 wt.% to about 75 wt.%, and in some embodiments, from about 30 wt.% to about 50 wt.% of the entire polymer composition. Liquid crystalline polymers are generally classified as “thermotropic” to the extent that they can possess a rod-like structure and exhibit a crystalline behavior in their molten state (e.g., thermotropic nematic state). The liquid crystalline polymers employed in the polymer composition typically have a melting temperature of about 200° C. or more, in some embodiments from about 220° C. to about 350° C., and in some embodiments, from about 240° C. to about 300° C. The melting temperature may be determined as is well known in the art using differential scanning calorimetry (“DSC”), such as determined by ISO Test No. 11357-3:2011. Such polymers may be formed from one or more types of repeating units as is known in the art. A liquid crystalline polymer may, for example, contain one or more aromatic ester repeating units generally represented by the following Formula (I):

wherein,

-   ring B is a substituted or unsubstituted 6-membered aryl group     (e.g., 1,4-phenylene or 1,3-phenylene), a substituted or     unsubstituted 6-membered aryl group fused to a substituted or     unsubstituted 5- or 6-membered aryl group (e.g., 2,6-naphthalene),     or a substituted or unsubstituted 6-membered aryl group linked to a     substituted or unsubstituted 5- or 6-membered aryl group (e.g.,     4,4-biphenylene); and -   Y₁ and Y₂ are independently O, C(O), NH, C(O)HN, or NHC(O).

Typically, at least one of Y₁ and Y₂ are C(O). Examples of such aromatic ester repeating units may include, for instance, aromatic dicarboxylic repeating units (Y₁ and Y₂ in Formula I are C(O)), aromatic hydroxycarboxylic repeating units (Y₁ is O and Y₂ is C(O) in Formula I), as well as various combinations thereof.

Aromatic hydroxycarboxylic repeating units, for instance, may be employed that are derived from aromatic hydroxycarboxylic acids, such as, 4-hydroxybenzoic acid; 4-hydroxy-4′-biphenylcarboxylic acid; 2-hydroxy-6-naphthoic acid; 2-hydroxy-5-naphthoic acid; 3-hydroxy-2-naphthoic acid; 2-hydroxy-3-naphthoic acid; 4′-hydroxyphenyl-4-benzoic acid; 3′-hydroxyphenyl-4-benzoic acid; 4′-hydroxyphenyl-3-benzoic acid, etc., as well as alkyl, alkoxy, aryl and halogen substituents thereof, and combination thereof. Particularly suitable aromatic hydroxycarboxylic acids are 4-hydroxybenzoic acid (“HBA”) and 6-hydroxy-2-naphthoic acid (“HNA”). When employed, repeating units derived from hydroxycarboxylic acids (e.g., HBA and/or HNA) typically constitute about 20 mol.% or more, in some embodiments from about 30 mol.% to about 70 mol.%, and in some embodiments, from about 35 mol.% to 60 mol.% of the polymer.

Aromatic dicarboxylic repeating units may also be employed that are derived from aromatic dicarboxylic acids, such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, diphenyl ether-4,4′-dicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4′-dicarboxybiphenyl, bis(4-carboxyphenyl)ether, bis(4-carboxyphenyl)butane, bis(4-carboxyphenyl)ethane, bis(3-carboxyphenyl)ether, bis(3-carboxyphenyl)ethane, etc., as well as alkyl, alkoxy, aryl and halogen substituents thereof, and combinations thereof. Particularly suitable aromatic dicarboxylic acids may include, for instance, terephthalic acid (“TA”), isophthalic acid (“IA”), and 2,6-naphthalenedicarboxylic acid (“NDA”). When employed, repeating units derived from aromatic dicarboxylic acids (e.g., IA, TA, and/or NDA) typically constitute from about 1 mol.% to about 50 mol.%, in some embodiments from about 10 mol.% to about 45 mol.%, and in some embodiments, from about 20 mol.% to about 40% of the polymer.

Other repeating units may also be employed in the polymer. In certain embodiments, for instance, repeating units may be employed that are derived from aromatic diols, such as hydroquinone, resorcinol, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 4,4′-dihydroxybiphenyl (or 4,4′-biphenol), 3,3′-dihydroxybiphenyl, 3,4′-dihydroxybiphenyl, 4,4′-dihydroxybiphenyl ether, bis(4-hydroxyphenyl)ethane, etc., as well as alkyl, alkoxy, aryl and halogen substituents thereof, and combinations thereof. Particularly suitable aromatic diols may include, for instance, hydroquinone (“HQ”) and 4,4′-biphenol (“BP”). When employed, repeating units derived from aromatic diols (e.g., HQ and/or BP) typically constitute from about about 1 mol.% to about 50 mol.%, in some embodiments from about 10 mol.% to about 45 mol.%, and in some embodiments, from about 20 mol.% to about 40% of the polymer. Repeating units may also be employed, such as those derived from aromatic amides (e.g., acetaminophen (“APAP”)) and/or aromatic amines (e.g., 4-aminophenol (“AP”), 3-aminophenol, 1,4-phenylenediamine, 1,3-phenylenediamine, etc.). When employed, repeating units derived from aromatic amides (e.g., APAP) and/or aromatic amines (e.g., AP) typically constitute from about 0.1 mol.% to about 20 mol.%, in some embodiments from about 0.5 mol.% to about 15 mol.%, and in some embodiments, from about 1 mol.% to about 10% of the polymer. It should also be understood that various other monomeric repeating units may be incorporated into the polymer. For instance, in certain embodiments, the polymer may contain one or more repeating units derived from non-aromatic monomers, such as aliphatic or cycloaliphatic hydroxycarboxylic acids, dicarboxylic acids, diols, amides, amines, etc. Of course, in other embodiments, the polymer may be “wholly aromatic” in that it lacks repeating units derived from non-aromatic (e.g., aliphatic or cycloaliphatic) monomers.

Although not necessarily required, the liquid crystalline polymer may be a “high naphthenic” polymer to the extent that it contains a relatively high content of repeating units derived from naphthenic hydroxycarboxylic acids and naphthenic dicarboxylic acids, such as naphthalene-2,6-dicarboxylic acid (“NDA”), 6-hydroxy-2-naphthoic acid (“HNA”), or combinations thereof. That is, the total amount of repeating units derived from naphthenic hydroxycarboxylic and/or dicarboxylic acids (e.g., NDA, HNA, or a combination of HNA and NDA) is typically about 10 mol.% or more, in some embodiments about 15 mol.% or more, and in some embodiments, from about 20 mol.% to about 60 mol.% of the polymer. Contrary to many conventional “low naphthenic” polymers, it is believed that the resulting “high naphthenic” polymers are capable of exhibiting good thermal and mechanical properties. In one particular embodiment, for instance, the repeating units derived from naphthalene-2,6-dicarboxylic acid (“NDA”) may constitute from about 10 mol.% to about 40 mol.%, in some embodiments from about 12 mol.% to about 35 mol.%, and in some embodiments, from about 15 mol.% to about 30 mol.% of the polymer.

B. Dielectric Material

To help achieve the desired dielectric properties, the polymer composition also contains a dielectric material. The dielectric material is typically employed in an amount of from about 10 wt.% to about 70 wt.%, in some embodiments from about 20 wt.% to about 60 wt.%, and in some embodiments, from about 30 wt.% to about 50 wt.% of the composition. As indicated above, the volume resistivity of the dielectric material is selectively controlled so that it is generally semi-conductive in nature. For example, the dielectric material may have have a volume resistivity of from about 0.1 ohm-cm to about 1 × 10¹² ohm-cm, in some embodiments about 0.5 ohm-cm to about 1 × 10¹¹ ohm-cm, in some embodiments from about 1 to about 1 × 10¹⁰ ohm-cm, and in some embodiments, from about 2 to about 1 × 10⁸ ohm-cm, such as determined at a temperature of about 20° C. in accordance with ASTM D257-14. This may be accomplished by selecting a single material having the desired volume resistivity, or by blending multiple materials together (e.g., insulative and electrically conductive) so that the resulting blend has the desired volume resistance.

In one embodiment, for example, inorganic oxide materials may be employed that may exhibit a linear response of electrical charge (or polarization) versus voltage. These materials may exhibit a total reversible polarization of charge within the crystal structure after the applied electrical field is removed. Suitable inorganic oxide materials for this purpose may include, for instance, ferroelectric and/or paraelectric materials. Examples of suitable ferroelectric materials include, for instance, barium titanate (BaTiO₃), strontium titanate (SrTiO₃), calcium titanate (CaTiO₃), magnesium titanate (MgTiO₃), strontium barium titanate (SrBaTiO₃), sodium barium niobate (NaBa₂Nb₅O₁₅), potassium barium niobate (KBa₂Nb₅O₁₅), calcium zirconate (CaZrO₃), titanite (CaTiSiO₅), as well as combinations thereof. Examples of suitable paraelectric materials likewise include, for instance, titanium dioxide (TiO₂), tantalum pentoxide (Ta₂O₅), hafnium dioxide (HfO₂), niobium pentoxide (Nb₂O₅), alumina (Al₂O₃), zinc oxide (ZnO), etc., as well as combinations thereof. Particularly suitable inorganic oxide materials are particles that include TiO₂, BaTiOs, SrTiOs, CaTiOs, MgTiO₃, BaSrTi₂O₆, and ZnO. Of course, other types of inorganic oxide materials (e.g., mica) may also be employed as a dielectric material. Carbon materials may likewise be employed, such as graphite, carbon black, etc.

The shape and size of the dielectric materials are not particularly limited and may include particles, fine powders, fibers, whiskers, tetrapod, plates, etc. In one embodiment, for instance, the dielectric material may include particles having an average diameter of from about 0.01 to about 100 micrometers, and in some embodiments, from about 0.10 to about 20 micrometers. In another embodiment, the dielectric material may include fibers and/or whiskers having an average diameter of from about 0.1 to about 35 micrometers, in some embodiments from about 0.2 to about 20 micrometers, and in some embodiments, from about 0.5 to about 15 micrometers. When employed, the whiskers may may have an aspect ratio of from about 1 to about 100, in some embodiments from about 2 to about 80, and in some embodiments, from about 4 to about 50. The volume average length of such whiskers may, for example, range from about 1 to about 200 micrometers, in some embodiments from about 2 to about 150 micrometers, and in some embodiments, from about 5 to about 100 micrometers.

Various techniques may be employed to help achieve the desired volume resistivity. In one embodiment, for instance, an inorganic oxide material may be employed that has a volume resistivity of from 0.1 ohm-cm to about 500 ohm-cm, in some embodiments about 0.5 ohm-cm to about 250 ohm-cm, in some embodiments from about 1 to about 100 ohm-cm, and in some embodiments, from about 2 to about 50 ohm-cm, such as determined at a temperature of about 20° C. in accordance with ASTM D257-14. One example of such a material includes inorganic oxide whiskers (e.g., zinc oxide whiskers) having a three-dimensional structure. For instance, the inorganic oxide whiskers may have a central body and a plurality of needle crystals extending radially therefrom to form the three-dimensional structure. When such whiskers are compounded into a resin, the needle crystals may be brought into very close contact with each other, thereby increasing the probability of forming a stable electrically conducting path. The number of needle crystals may vary, such as about 2 or more, in some embodiments from 3 to 8, and in some embodiments, from 4 to 6 (e.g., 4). When 4 needle crystals are present, for instance, the whiskers have a “tetrapod” form even though one or more of these needle crystal projections may be broken during processing and/or manufacturing. The central body and/or basal portion of the needle crystals may have an average diameter within the ranges noted above, such as from about 0.1 to about 35 micrometers, in some embodiments from about 0.2 to about 20 micrometers, and in some embodiments, from about 0.5 to about 15 micrometers. The volume average length of the need crystals (basal to tip) may likewise have a volume average length within the ranges noted above, such as from about 1 to about 200 micrometers, in some embodiments from about 2 to about 150 micrometers, and in some embodiments, from about 5 to about 100 micrometers. Such whiskers may be formed by thermally treating a metal powder (e.g., zinc) having an oxide film on the surface in an atmosphere containing molecular oxygen, such as described in U.S. Pat. No. 4,960,654 to Yoshinaka, et al. One particularly suitable type of whiskers having such characteristics include single-crystal, tetrapod zinc oxide whiskers available from Panasonic under the trade name Pana-Tetra™.

In another embodiment, a carbon material may be employed that has a volume resistivity of from about 1 × 10³ to about 1 × 10¹² ohm-cm, in some embodiments about 1 × 10⁴ to about 1 × 10¹¹ ohm-cm, in some embodiments from about 1 × 10⁵ to about 1 × 10¹⁰ ohm-cm, and in some embodiments, from about 1 × 10⁶ to about 1 × 10⁸ ohm-cm, such as determined at a temperature of about 20° C. in accordance with ASTM D257-14. For instance, a carbon material (e.g., particles, fibers, etc.) having a volume resistivity within the ranges noted above may be obtained by calcining an organic substance (e.g., petroleum tar, petroleum pitch, coal tar or coal pitch) at a high temperature (e.g., 400° to 900° C.) in an inert atmosphere, such as described in U.S. Pat. No. 8,642,682 to Nishihata, et al. The resulting carbon material typically has a high carbon content, such as about about 80 wt.% or more, in some embodiments about 85 wt.% or more, and in some embodiments, from about 90 wt.% to about 98 wt.%. One particularly suitable type of carbon material having such characteristics is available from Kureha Extron under the trade name Krefine™.

Of course, as noted above, electrically conductive materials may also be employed in combination with an insulative material to help achieve the desired volume resistance. The electrically conductive materials generally have a volume resistivity of less than about 0.1 ohm-cm, and in some embodiments, from about 1 × 10⁻⁸ to about 1 × 10⁻² ohm-cm, and the insulative materials generally have a volume resistivity of greater than about 1 × 10¹² ohm-cm, and in some embodiments, from about 1 × 10¹³ to about 1 × 10¹⁸ ohm-cm. Suitable electrically conductive materials may include, for instance, electrically conductive carbon materials (e.g., graphite, carbon black, fibers, graphene, nanotubes, etc.), metals, etc. Suitable insulative materials may likewise include inorganic oxide materials (e.g., particles) as described above, such as titanium dioxide (TiO₂). When employed, the ratio of the weight percentage of the insulative material in the polymer composition to the weight percentage of the electrically conductive material in the composition may be from about 3 to about 100, in some embodiments from about 3 to about 50, in some embodiments from about 3 to about 20, in some embodiments from about 7 to about 18, and in some embodiments, from about 8 to about 15. For example, the electrically conductive material may constitute from about 1 wt.% to about 20 wt.%, in some embodiments from about 3 wt.% to about 18 wt.%, and in some embodiments, from about 5 wt.% to about 15 wt.% of the dielectric material, while the insulative material may constitute from about 80 wt.% to about 99 wt.%, in some embodiments 82 wt.% to about 97 wt.%, and in some embodiments, from about 85 wt.% to about 95 wt.% of the dielectric material. Likewise, the electrically conductive material may constitute from about 0.1 wt.% to about 15 wt.%, in some embodiments from about 0.5 wt.% to about 12 wt.%, and in some embodiments, from about 1 wt.% to about 10 wt.% of the polymer composition, while the insulative material may constitute from about 20 wt.% to about 60 wt.%, in some embodiments 25 wt.% to about 55 wt.%, and in some embodiments, from about 30 wt.% to about 50 wt.% of the polymer composition.

C. Optional Additives

A wide variety of additional additives can also be included in the polymer composition, such as lubricants, fibrous filler, particulate fillers, thermally conductive fillers, pigments, antioxidants, stabilizers, surfactants, waxes, flame retardants, anti-drip additives, nucleating agents (e.g., boron nitride), flow modifiers, laser activatable additives, and other materials added to enhance properties and processability.

In some embodiments, the polymer composition may be “laser activatable” in the sense that it contains an additive that can be activated by a laser direct structuring (“LDS”) process to form an antenna element. In such a process, the additive is exposed to a laser that causes the release of metals. The laser thus draws the pattern of conductive elements onto the part and leaves behind a roughened surface containing embedded metal particles. These particles act as nuclei for the crystal growth during a subsequent plating process (e.g., copper plating, gold plating, nickel plating, silver plating, zinc plating, tin plating, etc.). When employed, laser activatable additives typically constitute from about 0.1 wt.% to about 30 wt.%, in some embodiments from about 0.5 wt.% to about 20 wt.%, and in some embodiments, from about 1 wt.% to about 10 wt.% of the polymer composition. The laser activatable additive generally includes spinel crystals, which may include two or more metal oxide cluster configurations within a definable crystal formation. For example, the overall crystal formation may have the following general formula:

wherein,

-   A is a metal cation having a valance of 2, such as cadmium,     chromium, manganese, nickel, zinc, copper, cobalt, iron, magnesium,     tin, titanium, etc., as well as combinations thereof; and -   B is a metal cation having a valance of 3, such as chromium, iron,     aluminum, nickel, manganese, tin, etc., as well as combinations     thereof.

Typically, A in the formula above provides the primary cation component of a first metal oxide cluster and B provides the primary cation component of a second metal oxide cluster. These oxide clusters may have the same or different structures. In one embodiment, for example, the first metal oxide cluster has a tetrahedral structure and the second metal oxide cluster has an octahedral cluster. Regardless, the clusters may together provide a singular identifiable crystal type structure having heightened susceptibility to electromagnetic radiation. Examples of suitable spinel crystals include, for instance, MgAl₂O₄, ZnAl₂O₄, FeAl₂O₄, CuFe₂O₄, CuCr₂O₄, MnFe₂O₄, NiFe₂O₄, TiFe₂O₄, FeCr₂O₄, MgCr₂O₄, etc. Copper chromium oxide (CuCr₂O₄) is particularly suitable for use in the present invention and is available from Shepherd Color Co. under the designation “Shepherd Black 1 GM.”

A fibrous filler may also be employed in the polymer composition to improve the thermal and mechanical properties of the composition without having a significant impact on electrical performance. The fibrous filler typically includes fibers having a high degree of tensile strength relative to their mass. For example, the ultimate tensile strength of the fibers (determined in accordance with ASTM D2101) is typically from about 1,000 to about 15,000 Megapascals (“MPa”), in some embodiments from about 2,000 MPa to about 10,000 MPa, and in some embodiments, from about 3,000 MPa to about 6,000 MPa. To help maintain the desired dielectric properties, such high strength fibers may be formed from materials that are generally insulative in nature, such as glass, ceramics (e.g., alumina or silica), aramids (e.g., Kevlar® marketed by E. I. duPont de Nemours, Wilmington, Del.), polyolefins, polyesters, etc. Glass fibers are particularly suitable, such as E-glass, A-glass, C-glass, D-glass, AR-glass, R-glass, S1-glass, S2-glass, etc.

Although the fibers employed in the fibrous filler may have a variety of different sizes, fibers having a certain aspect ratio can help improve the mechanical properties of the resulting polymer composition. That is, fibers having an aspect ratio (average length divided by nominal diameter) of from about 5 to about 50, in some embodiments from about 6 to about 40, and in some embodiments, from about 8 to about 25 are particularly beneficial. Such fibers may, for instance, have a weight average length of from about 100 to about 800 micrometers, in some embodiments from about 120 to about 500 micrometers, in some embodiments, from about 150 to about 350 micrometers, and in some embodiments, from about 200 to about 300 micrometers. The fibers may likewise have a nominal diameter of about 6 to about 35 micrometers, and in some embodiments, from about 9 to about 18 micrometers. The relative amount of the fibrous filler may also be selectively controlled to help achieve the desired mechanical and thermal properties without adversely impacting other properties of the composition, such as its flowability and dielectric properties, etc. For example, the fibrous filler may constitute from about 1 wt.% to about 40 wt.%, in some embodiments from about 3 wt.% to about 30 wt.%, and in some embodiments, from about 5 wt.% to about 20 wt.% of the polymer composition. When employed in combination with a laser activatable additive, the fibrous filler may also be employed in a sufficient amount so that the weight ratio of the fibrous filler to the combined amounts of the dielectric and laser activatable materials is from about 0.05 to about 1, in some embodiments from about 0.05 to about 0.5, in some embodiments from about 0.06 to about 0.4, and in some embodiments from about 0.1 to about 0.3.

II. Formation

The components used to form the polymer composition may be combined together using any of a variety of different techniques as is known in the art. In one particular embodiment, for example, the liquid crystalline polymer, dielectric material, and other optional additives are melt processed as a mixture within an extruder to form the polymer composition. The mixture may be melt-kneaded in a single-screw or multi-screw extruder at a temperature of from about 250° C. to about 450° C. In one embodiment, the mixture may be melt processed in an extruder that includes multiple temperature zones. The temperature of individual zones is typically set within about -60° C. to about 25° C. relative to the melting temperature of the liquid crystalline polymer. By way of example, the mixture may be melt processed using a twin screw extruder such as a Leistritz 18-mm co-rotating fully intermeshing twin screw extruder. A general purpose screw design can be used to melt process the mixture. In one embodiment, the mixture including all of the components may be fed to the feed throat in the first barrel by means of a volumetric feeder. In another embodiment, different components may be added at different addition points in the extruder, as is known. For example, the liquid crystalline polymer may be applied at the feed throat, and certain additives (e.g., dielectric material) may be supplied at the same or different temperature zone located downstream therefrom. Regardless, the resulting mixture can be melted and mixed then extruded through a die. The extruded polymer composition can then be quenched in a water bath to solidify and granulated in a pelletizer followed by drying.

The melt viscosity of the resulting composition is generally low enough that it can readily flow into the cavity of a mold to form the small-sized circuit substrate. For example, in one particular embodiment, the polymer composition may have a melt viscosity of from about 5 to about 100 Pa-s, in some embodiments from about 10 to about 95 Pa-s, and in some embodiments, from about 15 to about 90 Pa-s, determined at a shear rate of 1,000 seconds⁻¹. Melt viscosity may be determined in accordance with 11443:2005.

III. Substrate

Once formed, the polymer composition may be molded into the desired shape of a substrate for use in an antenna system. Due to the beneficial properties of the polymer composition, the resulting substrate may have a very small size, such as a thickness of about 5 millimeters or less, in some embodiments about 4 millimeters or less, and in some embodiments, from about 0.5 to about 3 millimeters. Typically, the shaped parts are molded using a one-component injection molding process in which dried and preheated plastic granules are injected into the mold. The conductive elements may be formed in a variety of ways, such as by plating, electroplating, laser direct structuring, etc. When containing spinel crystals as a laser activatable additive, for instance, activation with a laser may cause a physio-chemical reaction in which the spinel crystals are cracked open to release metal atoms. These metal atoms can act as a nuclei for metallization (e.g., reductive copper coating). The laser also creates a microscopically irregular surface and ablates the polymer matrix, creating numerous microscopic pits and undercuts in which the copper can be anchored during metallization.

If desired, the conductive elements may be antenna elements (e.g., antenna resonating elements) so that the resulting part forms an antenna system. The conductive elements can form antennas of a variety of different types, such as antennae with resonating elements that are formed from patch antenna elements, inverted-F antenna elements, closed and open slot antenna elements, loop antenna elements, monopoles, dipoles, planar inverted-F antenna elements, hybrids of these designs, etc. The resulting antenna system can be employed in a variety of different electronic components. As an example, the antenna system may be formed in electronic components, such as desktop computers, portable computers, handheld electronic devices, automotive equipment, etc. In one suitable configuration, the antenna system is formed in the housing of a relatively compact portable electronic component in which the available interior space is relatively small. Examples of suitable portable electronic components include cellular telephones, laptop computers, small portable computers (e.g., ultraportable computers, netbook computers, and tablet computers), wrist-watch devices, pendant devices, headphone and earpiece devices, media players with wireless communications capabilities, handheld computers (also sometimes called personal digital assistants), remote controllers, global positioning system (GPS) devices, handheld gaming devices, etc. The antenna could also be integrated with other components such as camera module, speaker or battery cover of a handheld device.

One particularly suitable electronic component is shown in FIGS. 1-2 is a handheld device 10 with cellular telephone capabilities. As shown in FIG. 1 , the device 10 may have a housing 12 formed from plastic, metal, other suitable dielectric materials, other suitable conductive materials, or combinations of such materials. A display 14 may be provided on a front surface of the device 10, such as a touch screen display. The device 10 may also have a speaker port 40 and other input-output ports. One or more buttons 38 and other user input devices may be used to gather user input. As shown in FIG. 2 , an antenna system 26 is also provided on a rear surface 42 of device 10, although it should be understood that the antenna system can generally be positioned at any desired location of the device. The antenna system may be electrically connected to other components within the electronic device using any of a variety of known techniques. Referring again to FIGS. 1-2 , for example, the housing 12 or a part of housing 12 may serve as a conductive ground plane for the antenna system 26. This is more particularly illustrated in FIG. 3 , which shows the antenna system 26 as being fed by a radiofrequency source 52 at a positive antenna feed terminal 54 and a ground antenna feed terminal 56. The positive antenna feed terminal 54 may be coupled to an antenna resonating element 58, and the ground antenna feed terminal 56 may be coupled to a ground element 60. The resonating element 58 may have a main arm 46 and a shorting branch 48 that connects main arm 46 to ground 60.

Various other configurations for electrically connecting the antenna system are also contemplated. In FIG. 4 , for instance, the antenna system is based on a monopole antenna configuration and the resonating element 58 has a meandering serpentine path shape. In such embodiments, the feed terminal 54 may be connected to one end of resonating element 58, and the ground feed terminal 56 may be coupled to housing 12 or another suitable ground plane element. In another embodiment as shown in FIG. 5 , conductive antenna elements 62 are configured to define a closed slot 64 and an open slot 66. The antenna formed from structures 62 may be fed using positive antenna feed terminal 54 and ground antenna feed terminal 56. In this type of arrangement, slots 64 and 66 serve as antenna resonating elements for the antenna element 26. The sizes of the slots 64 and 66 may be configured so that the antenna element 26 operates in desired communications bands (e.g., 2.4 GHz and 5 GHz, etc.). Another possible configuration for the antenna system 26 is shown in FIG. 6 . In this embodiment, the antenna element 26 has a patch antenna resonating element 68 and may be fed using positive antenna feed terminal 54 and ground antenna feed terminal 56. The ground 60 may be associated with housing 12 or other suitable ground plane elements in device 10. FIG. 7 shows yet another illustrative configuration that may be used for the antenna elements of the antenna system 26. As shown, antenna resonating element 58 has two main arms 46A and 46B. The arm 46A is shorter than the arm 46B and is therefore associated with higher frequencies of operation than the arm 46A. By using two or more separate resonating element structures of different sizes, the antenna resonating element 58 can be configured to cover a wider bandwidth or more than a single communications band of interest.

In certain embodiments of the present invention, the polymer composition may be particularly well suited for high frequency antennas and antenna arrays for use in base stations, repeaters (e.g., “femtocells”), relay stations, terminals, user devices, and/or other suitable components of 5G systems. As used herein, “5G” generally refers to high speed data communication over radio frequency signals. 5G networks and systems are capable of communicating data at much faster rates than previous generations of data communication standards (e.g., “4G, “LTE”). For example, as used herein, “5G frequencies” can refer to frequencies that are 1.5 GHz or more, in some embodiments about 2.0 GHz or more, in some embodiments about 2.5 GHz or higher, in some embodiments about 3.0 GHz or higher, in some embodiments from about 3 GHz to about 300 GHz, or higher, in some embodiments from about 4 GHz to about 80 GHz, in some embodiments from about 5 GHz to about 80 GHz, in some embodiments from about 20 GHz to about 80 GHz, and in some embodiments from about 28 GHz to about 60 GHz. Various standards and specifications have been released quantifying the requirements of 5G communications. As one example, the International Telecommunications Union (ITU) released the International Mobile Telecommunications-2020 (“IMT-2020”) standard in 2015. The IMT-2020 standard specifies various data transmission criteria (e.g., downlink and uplink data rate, latency, etc.) for 5G. The IMT-2020 Standard defines uplink and downlink peak data rates as the minimum data rates for uploading and downloading data that a 5G system must support. The IMT-2020 standard sets the downlink peak data rate requirement as 20 Gbit/s and the uplink peak data rate as 10 Gbit/s. As another example, 3^(rd) Generation Partnership Project (3GPP) recently released new standards for 5G, referred to as “5G NR.” 3GPP published “Release 15” in 2018 defining “Phase 1” for standardization of 5G NR. 3GPP defines 5G frequency bands generally as “Frequency Range 1” (FR1) including sub-6GHz frequencies and “Frequency Range 2” (FR2) as frequency bands ranging from 20-60 GHz. Antenna systems described herein can satisfy or qualify as “5G” under standards released by 3GPP, such as Release 15 (2018), and/or the IMT-2020 Standard.

To achieve high speed data communication at high frequencies, antenna elements and arrays may employ small feature sizes/spacing (e.g., fine pitch technology) that can improve antenna performance. For example, the feature size (spacing between antenna elements, width of antenna elements) etc. is generally dependent on the wavelength (“λ”) of the desired transmission and/or reception radio frequency propagating through the substrate dielectric on which the antenna element is formed (e.g., nλ/4 where n is an integer). Further, beamforming and/or beam steering can be employed to facilitate receiving and transmitting across multiple frequency ranges or channels (e.g., multiple-in-multiple-out (MIMO), massive MIMO).

The high frequency 5G antenna elements can have a variety of configurations. For example, the 5G antenna elements can be or include co-planar waveguide elements, patch arrays (e.g., mesh-grid patch arrays), other suitable 5G antenna configurations. The antenna elements can be configured to provide MIMO, massive MIMO functionality, beam steering, and the like. As used herein “massive” MIMO functionality generally refers to providing a large number transmission and receiving channels with an antenna array, for example 8 transmission (Tx) and 8 receive (Rx) channels (abbreviated as 8×8). Massive MIMO functionality may be provided with 8×8, 12×12, 16×16, 32×32, 64×64, or greater.

The antenna elements can have a variety of configurations and arrangements and can be fabricated using a variety of manufacturing techniques. As one example, the antenna elements and/or associated elements (e.g., ground elements, feed lines, etc.) can employ fine pitch technology. Fine pitch technology generally refers to small or fine spacing between their components or leads. For example, feature dimensions and/or spacing between antenna elements (or between an antenna element and a ground plane) can be about 1,500 micrometers or less, in some embodiments 1,250 micrometers or less, in some embodiments 750 micrometers or less (e.g., center-to-center spacing of 1.5 mm or less), 650 micrometers or less, in some embodiments 550 micrometers or less, in some embodiments 450 micrometers or less, in some embodiments 350 micrometers or less, in some embodiments 250 micrometers or less, in some embodiments 150 micrometers or less, in some embodiments 100 micrometers or less, and in some embodiments 50 micrometers or less. However, it should be understood that feature sizes and/or spacings that are smaller and/or larger may be employed within the scope of this disclosure.

As a result of such small feature dimensions, antenna systems can be achieved with a large number of antenna elements in a small footprint. For example, an antenna array can have an average antenna element concentration of greater than 1,000 antenna elements per square centimeter, in some embodiments greater than 2,000 antenna elements per square centimeter, in some embodiments greater than 3,000 antenna elements per square centimeter, in some embodiments greater than 4,000 antenna elements per square centimeter, in some embodiments greater than 6,000 antenna elements per square centimeter, and in some embodiments greater than about 8,000 antenna elements per square centimeter. Such compact arrangement of antenna elements can provide a greater number of channels for MIMO functionality per unit area of the antenna area. For example, the number of channels can correspond with (e.g., be equal to or proportional with) the number of antenna elements.

Referring to FIG. 8 , one embodiment of a 5G antenna system 100 is shown that also includes a base station 102, one or more relay stations 104, one or more user computing devices 106, one or more Wi-Fi repeaters 108 (e.g., “femtocells”), and/or other suitable antenna components for the 5G antenna system 100. The relay stations 104 can be configured to facilitate communication with the base station 102 by the user computing devices 106 and/or other relay stations 104 by relaying or “repeating” signals between the base station 102 and the user computing devices 106 and/or relay stations 104. The base station 102 can include a MIMO antenna array 110 configured to receive and/or transmit radio frequency signals 112 with the relay station(s) 104, Wi-Fi repeaters 108, and/or directly with the user computing device(s) 106. The user computing device 306 is not necessarily limited by the present invention and include devices such as 5G smartphones.

The MIMO antenna array 110 can employ beam steering to focus or direct radio frequency signals 112 with respect to the relay stations 104. For example, the MIMO antenna array 110 can be configured to adjust an elevation angle 114 with respect to an X-Y plane and/or a heading angle 116 defined in the Z-Y plane and with respect to the Z direction. Similarly, one or more of the relay stations 104, user computing devices 106, Wi-Fi repeaters 108 can employ beam steering to improve reception and/or transmission ability with respect to MIMO antenna array 110 by directionally tuning sensitivity and/or power transmission of the device 104, 106, 108 with respect to the MIMO antenna array 110 of the base station 102 (e.g., by adjusting one or both of a relative elevation angle and/or relative azimuth angle of the respective devices).

FIGS. 9A and 9B illustrate a top-down and side elevation view, respectively, of an example user computing device 106. The user computing device 106 may include one or more antenna elements 200, 202 (e.g., arranged as respective antenna arrays). Referring to FIG. 9A, the antenna elements 200, 202 can be configured to perform beam steering in the X-Y plane (as illustrated by arrows 204, 206 and corresponding with a relative azimuth angle). Referring to FIG. 9B, the antenna elements 200, 202 can be configured to perform beam steering in the Z-Y plane (as illustrated by arrows 204, 206).

FIG. 10 depicts a simplified schematic view of a plurality of antenna arrays 302 connected using respective feed lines 304 (e.g., with a front end module). The antenna arrays 302 can be mounted to a side surface 306 of a substrate 308, which may be formed from the polymer composition of the present invention. The antenna arrays 302 can include a plurality of vertically connected elements (e.g., as a mesh-grid array). Thus, the antenna array 302 can generally extend parallel with the side surface 306 of the substrate 308. Shielding can optionally be provided on the side surface 306 of the substrate 308 such that the antenna arrays 302 are located outside of the shielding with respect to the substrate 308. The vertical spacing distance between the vertically connected elements of the antenna array 302 can correspond with the “feature sizes” of the antenna arrays 320. As such, in some embodiments, these spacing distances may be relatively small (e.g., less than about 750 micrometers) such that the antenna array 302 is a “fine pitch” antenna array 302.

FIG. 11 illustrates a side elevation view of a co-planar waveguide antenna 400 configuration. One or more co-planar ground layers 402 can be arranged parallel with an antenna element 404 (e.g., a patch antenna element). Another ground layer 406 may be spaced apart from the antenna element by a substrate 408, which may be formed from the polymer composition of the present invention. One or more additional antenna elements 410 can be spaced apart from the antenna element 404 by a second layer or substrate 412, which may also be formed from the polymer composition of the present invention. The dimensions “G” and “W” may correspond with “feature sizes” of the antenna 400. The “G” dimension may correspond with a distance between the antenna element 404 and the co-planar ground layer(s) 406. The “W” dimension can correspond with a width (e.g., linewidth) of the antenna element 404. As such, in some embodiments, dimensions “G” and “W” may be relatively small (e.g., less than about 750 micrometers) such that the antenna 400 is a “fine pitch” antenna 400.

FIG. 12A illustrates an antenna array 500 according to another aspect of the present disclosure. The antenna array 500 can include a substrate 510, which may be formed from the polymer composition of the present invention, and a plurality of antenna elements 520 formed thereon. The plurality of antenna elements 520 can be approximately equally sized in the X- and/or Y-directions (e.g., square or rectangular). The plurality of antenna elements 520 can be spaced apart approximately equally in the X- and/or Y-directions. The dimensions of the antenna elements 520 and/or spacing therebetween can correspond with “feature sizes” of the antenna array 500. As such, in some embodiments, the dimensions and/or spacing may be relatively small (e.g., less than about 750 micrometers) such that the antenna array 500 is a “fine pitch” antenna array 500. As illustrated by the ellipses 522, the number of columns of antenna elements 520 illustrated in FIG. 12 is provided as an example only. Similarly, the number of rows of antenna element 520 is provided as an example only.

The tuned antenna array 500 can be used to provide massive MIMO functionality, for example in a base station (e.g., as described above with respect to FIG. 8 ). More specifically, radio frequency interactions between the various elements can be controlled or tuned to provide multiple transmitting and/or receiving channels. Transmitting power and/or receiving sensitivity can be directionally controlled to focus or direct radio frequency signals, for example as described with respect to the radio frequency signals 112 of FIG. 8 . The tuned antenna array 500 can provide a large number of antenna elements 522 in a small footprint. For example, the tuned antenna 500 can have an average antenna element concentration of 1,000 antenna elements per square cm or greater. Such compact arrangement of antenna elements can provide a greater number of channels for MIMO functionality per unit area. For example, the number of channels can correspond with (e.g., be equal to or proportional with) the number of antenna elements.

FIG. 12B illustrates an antenna array 540 formed with laser direct structuring, which may optionally be employed to form the antenna elements. The antenna array 540 can include a plurality of antenna elements 542 and plurality of feed lines 544 connecting the antenna elements 542 (e.g., with other antenna elements 542, a front end module, or other suitable component). The antenna elements 542 can have respective widths “w” and spacing distances “S₁” and “S₂” therebetween (e.g., in the X-direction and Y-direction, respectively). These dimensions can be selected to achieve 5G radio frequency communication at a desired 5G frequency. More specifically, the dimensions can be selected to tune the antenna array 540 for transmission and/or reception of data using radio frequency signals that are within the 5G frequency spectrum. The dimensions can be selected based on the material properties of the substrate. For example, one or more of “w”, “S₁,” or “S₂” can correspond with a multiple of a propagation wavelength (“λ”) of the desired frequency through the substrate material (e.g., nλ/4 where n is an integer).

As one example, λ can be calculated as follows:

$\lambda = \frac{c}{f\sqrt{\in_{R}}}$

where c is the speed of light in a vacuum, ∈_(R) is the dielectric constant of the substrate (or surrounding material), f is the desired frequency.

FIG. 12C illustrates an example antenna configuration 560 according to aspects of the present disclosure. The antenna configuration 560 can include multiple antenna elements 562 arranged in parallel long edges of a substrate 564, which may be formed from the polymer composition of the present invention. The various antenna elements 562 can have respective lengths, “L” (and spacing distances therebetween) that tune the antenna configuration 560 for reception and/or transmission at a desired frequency and/or frequency range. More specifically, such dimensions can be selected based on a propagation wavelength, λ, at the desired frequency for the substrate material, for example as described above with reference to FIG. 12B.

FIGS. 13A through 13C depict simplified sequential diagrams of a laser direct structuring manufacturing process that can be used to form antenna elements and/or arrays according to aspects of the present disclosure. Referring to FIG. 13A, a substrate 600 can be formed from the polymer composition of the present invention using any desired technique (e.g., injection molding). In certain embodiments, as shown in FIG. 13B, a laser 602 can be used to activate the laser activatable additive to form a circuit pattern 604 that can include one or more of the antenna elements and/or arrays. For example, the laser can melt conductive particles in the polymer composition to form the circuit pattern 604. Referring to FIG. 13C, the substrate 600 can be submerged in an electroless copper bath to plate the circuit pattern 604 and form the antenna elements, elements arrays, other components, and/or conductive lines therebetween.

The present invention may be better understood with reference to the following examples.

Test Methods

Melt Viscosity: The melt viscosity (Pa-s) may be determined in accordance with ISO Test No. 11443:2005 at a shear rate of 400 s⁻¹ and temperature 15° C. above the melting temperature (e.g., about 350° C.) using a Dynisco LCR7001 capillary rheometer. The rheometer orifice (die) had a diameter of 1 mm, length of 20 mm, L/D ratio of 20.1, and an entrance angle of 180°. The diameter of the barrel was 9.55 mm + 0.005 mm and the length of the rod was 233.4 mm.

Melting Temperature: The melting temperature (“Tm”) may be determined by differential scanning calorimetry (“DSC”) as is known in the art. The melting temperature is the differential scanning calorimetry (DSC) peak melt temperature as determined by ISO Test No. 11357-2:2013. Under the DSC procedure, samples were heated and cooled at 20° C. per minute as stated in ISO Standard 10350 using DSC measurements conducted on a TA Q2000 Instrument.

Deflection Temperature Under Load (“DTUL”): The deflection under load temperature may be determined in accordance with ISO Test No. 75-2:2013 (technically equivalent to ASTM D648-07). More particularly, a test strip sample having a length of 80 mm, thickness of 10 mm, and width of 4 mm may be subjected to an edgewise three-point bending test in which the specified load (maximum outer fibers stress) was 1.8 Megapascals. The specimen may be lowered into a silicone oil bath where the temperature is raised at 2° C. per minute until it deflects 0.25 mm (0.32 mm for ISO Test No. 75-2:2013).

Tensile Modulus, Tensile Stress, and Tensile Elongation: Tensile properties may be tested according to ISO Test No. 527:2012 (technically equivalent to ASTM D638-14). Modulus and strength measurements may be made on the same test strip sample having a length of 80 mm, thickness of 10 mm, and width of 4 mm. The testing temperature may be 23° C., and the testing speeds may be 1 or 5 mm/min.

Flexural Modulus, Flexural Stress, and Flexural Elongation: Flexural properties may be tested according to ISO Test No. 178:2010 (technically equivalent to ASTM D790-10). This test may be performed on a 64 mm support span. Tests may be run on the center portions of uncut ISO 3167 multi-purpose bars. The testing temperature may be 23° C. and the testing speed may be 2 mm/min.

Unnotched and Notched Charpy Impact Strength: Charpy properties may be tested according to ISO Test No. ISO 179-1:2010) (technically equivalent to ASTM D256-10, Method B). This test may be run using a Type 1 specimen size (length of 80 mm, width of 10 mm, and thickness of 4 mm). When testing the notched impact strength, the notch may be a Type A notch (0.25 mm base radius). Specimens may be cut from the center of a multi-purpose bar using a single tooth milling machine. The testing temperature may be 23° C.

Dielectric Constant (“Dk”) and Dissipation Factor (“Df”): The dielectric constant (or relative static permittivity) and dissipation factor are determined using a known split-post dielectric resonator technique, such as described in Baker-Jarvis, et al., IEEE Trans. on Dielectric and Electrical Insulation, 5(4), p. 571 (1998) and Krupka, et al., Proc. 7^(th) International Conference on Dielectric Materials: Measurements and Applications, IEEE Conference Publication No. 430 (September 1996). More particularly, a plaque sample having a size of 80 mm × 80 mm × 1 mm was inserted between two fixed dielectric resonators. The resonator measured the permittivity component in the plane of the specimen. Five (5) samples are tested and the average value is recorded. The split-post resonator can be used to make dielectric measurements in the low gigahertz region, such as 1 GHz from 2 GHz.

Heat Cycle Test: Specimens are placed in a temperature control chamber and heated/cooled within a temperature range of from -30° C. and 100° C. Initially, the samples are heated until reaching a temperature of 100° C., when they were immediately cooled. When the temperature reaches -30° C., the specimens are immediately heated again until reaching 100° C. Twenty three (23) heating/cooling cycles may be performed over a 3-hour time period.

Example 1

Samples 1-5 are formed from various combinations of liquid crystalline polymers (LCP 1, LCP 2, LCP 3, or LCP 4), titanium dioxide, graphite, copper chromite filler (CuCr₂O₄), glass fibers, and alumina trihydrate. LCP 1 is formed from 48% HNA, 2% HBA, 25% BP, and 25% TA. LCP 2 is formed from 43% HBA, 20% NDA, 9% TA, and 28% HQ. LCP 3 is formed from 73% HBA and 27% HNA. LCP 4 is formed from 60% HBA, 4.2% HNA, 17.9% TA, and 17.9% BP. Compounding was performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (60 mm × 60 mm).

TABLE 1 1 2 3 4 5 LCP 1 34.7 34.7 29.7 24.7 LCP 2 31.5 LCP 3 7.5 - - 3.75 7.5 LCP 4 16 - - - - Glass Fibers 20 10 5 10 10 Alumina Trihydrate 0.5 0.3 0.3 0.3 0.3 Titanium Dioxide 15 55 60 55 55 Graphite 2.5 1.25 2.5 Copper Chromite 4 - - - - Black Pigment 3

Samples 1-5 were tested for thermal and mechanical properties. The results are set forth below in Table 2.

TABLE 2 Sample 1 2 3 4 5 Dielectric Constant (2 GHz) 7.0 8.7 9.4 11.8 16.0 Dissipation Factor (2 GHz) 0.0088 0.0024 0.002 0.005 0.0126 DTUL at 1.8 MPa (°C) 252 303 287 295 265 Charpy Notched (kJ/m²) 18.4 5.8 4.7 5.4 5.2 Charpy Unnotched (kJ/m²) 135 90 72 91 86 Tensile Strength (MPa) 13,472 13,804 12,879 14,077 14,878 Tensile Modulus (MPa) 1.4 0.7 0.6 0.7 0.63 Tensile Elongation (%) 179 150 141 133 129 Flexural Strength (MPa) 13,387 14,670 14,031 15,123 15,872 Flexural Modulus (MPa) 1.8 1.21 1.24 1.02 0.96 Flexural Elongation (%) 16.2 4.2 2.7 4.3 3.5 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 41.3 37.6 36.4 39.2 47.1 Melting Temperature (°C, 1^(st) heat of DSC) 304.73 338.75 336.6 338.2 338.73

Example 2

Samples 6-10 are formed from various combinations of liquid crystalline polymers (LCP 1, LCP 2, or LCP 3), titanium dioxide, graphite or carbon fibers, glass fibers, alumina trihydrate, and PPS. Compounding was performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (60 mm × 60 mm).

TABLE 3 6 7 8 9 10 LCP 1 35 - - - - LCP 2 - 34.5 24.5 29.5 39.5 LCP 3 - - 26.25 21 - Glass Fibers - - 10 10 10 Alumina Trihydrate - 0.5 0.5 0.5 0.5 Titanium Dioxide 65 65 30 30 30 Graphite - - 8.75 - - Carbon Fibers - - - 9 - PPS - - - - 20

Samples 6-10 were tested for thermal and mechanical properties. The results are set forth below in Table 4.

TABLE 4 Sample 6 7 8 9 10 Dielectric Constant (2 GHz) 9.7 10.1 4.9 - - Dissipation Factor (2 GHz) 0.0017 0.0032 0.3474 - - DTUL at 1.8 MPa (°C) 229 214 247 247 256 Charpy Notched (kJ/m²) 1.4 1.5 15 20 3 Charpy Unnotched (kJ/m²) 229 214 247 247 256 Tensile Strength (MPa) 49 54 126 137 68 Tensile Modulus (MPa) 10,263 9,602 13,704 17,449 8,558 Tensile Elongation (%) 0.53 0.66 1.52 1.35 0.97 Flexural Strength (MPa) 111 108 171 192 99 Flexural Modulus (MPa) 11,628 10,389 14,128 17,271 8,781 Flexural Elongation (%) 1.23 1.45 2.04 1.67 1.34 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 92.3 107.2 51.3 35.3 54.6 Melting Temperature (°C, 1^(st) heat of DSC) 337.45 315.75 312.46 310.96 317.07

Example 3

Samples 11-15 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), titanium dioxide, graphite, copper chromite filler (CuCr₂O₄), glass fibers, and alumina trihydrate. Compounding was performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (80 mm × 80 mm × 3 mm).

TABLE 5 11 12 13 14 15 LCP 2 14.5 14.5 14.5 14.5 12.5 LCP 3 3.75 5.25 7.5 9.75 11.25 LCP 4 17.6 17.6 17.6 17.6 17.6 Glass Fibers 10 10 10 10 10 Alumina Trihydrate 0.5 0.5 0.5 0.5 0.5 Titanium Dioxide 48 46 43 40 40 Graphite 1.25 1.75 2.5 3.25 3.75 Copper Chromite 4.4 4.4 4.4 4.4 4.4

Samples 11-15 were tested for thermal and mechanical properties. The results are set forth below in Table 6.

TABLE 6 Sample 11 12 13 14 15 Dielectric Constant (2 GHz) 11.6 12.4 12.1 12.7 16.6 Dissipation Factor (2 GHz) 0.012 0.015 0.015 0.017 0.031 DTUL at 1.8 MPa (°C) 221 223 228 229 Charpy Notched (kJ/m²) 2.8 3.6 5.4 6.2 5 Charpy Unnotched (kJ/m²) 5.2 5.5 7.2 8.2 6.3 Tensile Strength (MPa) 78 81 92 99 92 Tensile Modulus (MPa) 13,665 13,695 13,691 13,572 14,062 Tensile Elongation (%) 0.66 0.69 0.83 0.93 0.82 Flexural Strength (MPa) 116 126 132 144 134 Flexural Modulus (MPa) 14,692 14,723 14,547 14,567 15,037 Flexural Elongation (%) 0.96 1.08 1.16 1.33 1.19 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 90 89 81 74 87 Melting Temperature (°C, 1^(st) heat of DSC) 333 332 333 333 333

Example 4

Samples 16-22 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), graphite, carbon fibers, copper chromite filler (CuCr₂O₄), and glass fibers. Compounding was performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (60 mm × 60 mm).

TABLE 7 16 17 18 19 20 21 22 LCP 2 8 18 28 38 33 - - LCP 3 35 28 21 14 17.5 47.25 51 LCP 4 17.6 17.6 17.6 17.6 17.6 17.6 17.6 Glass Fibers 20 20 20 20 20 15 10 Graphite - - - - - 15.75 17 Carbon Fibers 15 12 9 6 7.5 - - Copper Chromite 4.4 4.4 4.4 4.4 4.4 4.4 4.4

Samples 16-22 were tested for thermal and mechanical properties. The results are set forth below in Table 8.

TABLE 8 Sample 16 17 18 19 20 21 22 Dielectric Constant (2 GHz) - - 22 38 26 - - Dissipation Factor (2 GHz) - - 0.045 0.09 0.06 - - DTUL at 1.8 MPa (°C) 222 228 240 245 246 231 228 Charpy Notched (kJ/m²) 29.9 33.6 37.4 44.6 34 29 30 Charpy Unnotched (kJ/m²) 32.8 32.6 28.4 28.2 44 37 39 Tensile Strength (MPa) 157 170 172 170 175 127 125 Tensile Modulus (MPa) 21,731 20,982 19,385 17,536 18,682 12,981 11,610 Tensile Elongation (%) 1.49 1.67 1.65 1.72 1.66 2.02 2.87 Flexural Strength (MPa) 236 243 245 240 244 194 182 Flexural Modulus (MPa) 22,078 20584 18,897 16,749 18,167 13,749 12,642 Flexural Elongation (%) 1.93 2.14 2.39 2.69 2.5 2.86 3.33 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 25.2 26.6 30.8 34 34.9 46.6 45.0

Example 5

Samples 23-27 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), copper chromite (CuCr₂O₄), glass fibers, zinc oxide single-crystal, tetrapod whiskers (Pana-Tetra™ from Panasonic), conductive graphite, and/or semi-conductive graphite (Krefine™ from Kureha Extron, volume resistivity of 3 × 10⁷ ohm-cm). Compounding was performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (60 mm × 60 mm).

TABLE 9 23 24 25 26 27 LCP 2 46 36 26 43 38 LCP 3 5.25 5.25 5.25 - - LCP 4 17.6 17.6 17.6 17.6 17.6 Glass Fibers 15 15 15 20 20 Conductive Graphite 1.75 1.75 1.75 - - Semi-Conductive Graphite 15 20 ZnO Whiskers 10 10 10 - - Copper Chromite 4.4 4.4 4.4 4.4 4.4

Samples 23-27 were tested for electrical, thermal, and mechanical properties. The results are set forth below in Table 10.

TABLE 10 Sample 23 24 25 26 27 Dielectric Constant (2 GHz) 8.36 12.13 - 4.13 11.85 Dissipation Factor (2 GHz) 0.09 0.24 - 0.0189 0.2077 DTUL at 1.8 MPa (°C) 256 254 254 255 253 Charpy Notched (kJ/m²) 29 16 8 7.2 5.2 Charpy Unnotched (kJ/m²) 34 26 14 22.5 16.5 Tensile Strength (MPa) 154 145 124 124 107 Tensile Modulus (MPa) 12,080 12,879 13,767 12216 11623 Tensile Elongation (%) 2.19 1.68 1.14 1.65 1.31 Flexural Strength (MPa) 209 207 177 183 166 Flexural Modulus (MPa) 11,779 12,682 13,880 11647 11435 Flexural Elongation (%) 2.76 2.34 1.57 2.18 1.9 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 46.7 59.2 72.7 141 146

Sample 27 was also subjected to a heat cycle test as described above. After testing, it was determined that the dielectric constant was 11.36 and the dissipation factor was 0.1566. Thus, the ratio of the dielectric constant after heat cycle testing to the initial dielectric constant was 0.96, and the ratio of the dissipation factor after heat cycle testing to the initial dissipation factor was 0.75.

Example 6

Samples 28-30 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), carbon fibers, copper chromite filler (CuCr₂O₄), and glass fibers. Compounding was performed using a 32 mm twin screw extruder. Parts are injection molded the samples into plaques (80 mm × 90 mm × 3 mm).

TABLE 11 28 29 30 LCP 2 40 43 45 LCP 3 12.6 10.5 9.1 LCP 4 17.6 17.6 17.6 Glass Fibers 20 20 20 Carbon Fibers 5.4 4.5 3.9 Copper Chromite 4.4 4.4 4.4

Samples 28-30 were tested for thermal and mechanical properties. The results are set forth below in Table 12.

TABLE 12 Sample 28 29 30 Dielectric Constant (2 GHz) 18.2 15.0 13.3 Dissipation Factor (2 GHz) 0.028 0.0198 0.0177 DTUL at 1.8 MPa (°C) 251 255 254 Charpy Notched (kJ/m²) 28 27 29 Charpy Unnotched (kJ/m²) 39 43 45 Tensile Strength (MPa) 170 168 169 Tensile Modulus (MPa) 16690 15741 15444 Tensile Elongation (%) 1.9 1.99 2.02 Flexural Strength (MPa) 239 240 230 Flexural Modulus (MPa) 16321 16386 15574 Flexural Elongation (%) 2.62 2.57 2.57 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 34 35 33

Samples 28-30 were also subjected to a heat cycle test as described above. Upon testing, it was determined that the resulting dissipation factor for the samples was 0.032, 0.025, and 0.020, respectively. Thus, the ratio of the dissipation after heat cycle testing to the initial dissipation factor for Samples 28, 29, and 30 was 1.14, 1.26, and 1.13, respectively.

Example 7

Samples 31-34 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), alumina trihydrate (ATH), titanium dioxide, carbon fibers, copper chromite filler (CuCr₂O₄), and glass fibers. Compounding was performed using a 32-mm twin screw extruder. Parts are injection molded the samples into plaques (80 mm × 90 mm × 3 mm).

TABLE 13 31 32 33 34 LCP 2 14.5 14.5 12.5 13.0 LCP 3 4.9 7.0 7.0 7.0 LCP 4 17.6 17.6 17.6 17.6 ATH 0.5 0.5 0.5 - Titanium Dioxide 46 40 40 40 Glass Fibers 10 13 15 15 Carbon Fibers 2.1 3.0 3.0 3.0 Copper Chromite 4.4 4.4 4.4 4.4

Samples 31-34 were tested for thermal and mechanical properties. The results are set forth below in Table 14.

TABLE 14 Sample 31 32 33 34 Dielectric Constant (2 GHz) 19.84 - 22.36 21.59 Dissipation Factor (2 GHz) 0.0251 - 0.0326 0.0346 DTUL at 1.8 MPa (°C) 228 233 232 229 Tensile Strength (MPa) 97 113 112 97 Tensile Modulus (MPa) 14674 15761 16113 15900 Tensile Elongation (%) 0.86 1 0.92 0.77 Flexural Strength (MPa) 143 162 159 143 Flexural Modulus (MPa) 14591 15345 16612 15978 Flexural Elongation (%) 1.25 1.41 1.22 1.08

Example 8

Samples 35-40 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), alumina trihydrate (ATH), titanium dioxide, carbon fibers, copper chromite filler (CuCr₂O₄), and glass fibers. Compounding was performed using a 32-mm twin screw extruder. Parts are injection molded the samples into plaques (80 mm × 90 mm × 3 mm).

TABLE 15 35 36 37 38 39 40 LCP 2 15.5 14.5 13.5 14.5 11.5 16.5 LCP 3 8.4 9.1 9.8 5.6 6.2 6.2 LCP 4 17.6 17.6 17.6 17.6 17.6 17.6 ATH 0.5 0.5 0.5 0.5 0.5 0.5 Titanium Dioxide 40 40 40 35 40 35 Glass Fibers 10 10 10 20 20 20 Carbon Fibers 3.6 3.9 4.2 2.4 1.8 1.8 Copper Chromite 4.4 4.4 4.4 4.4 4.4 4.4

Samples 35-40 were tested for thermal and mechanical properties. The results are set forth below in Table 16.

TABLE 16 Sample 35 36 37 38 39 40 Dielectric Constant (2 GHz) - 32.71 35 15.2 14.9 13.0 Dissipation Factor (2 GHz) - 0.0421 0.0652 0.0211 0.0171 0.0160 DTUL at 1.8 MPa (°C) 231 229 229 244 239 245 Tensile Strength (MPa) 108 107 108 117 104 116 Tensile Modulus (MPa) 14809 15218 15286 17511 17829 16871 Tensile Elongation (%) 1.01 0.95 0.97 0.89 0.77 0.94 Flexural Strength (MPa) 162 164 164 174 157 174 Flexural Modulus (MPa) 15258 15833 16157 17236 17875 17056 Flexural Elongation (%) 1.45 1.41 1.38 1.28 1.05 1.31

Samples 38-40 were also subjected to a heat cycle test as described above. Upon testing, it was determined that the resulting dissipation factor for the samples was 0.01764, 0.0155, and 0.0142, respectively. Thus, the ratio of the dissipation factor after heat cycle testing to the initial dissipation factor for Samples 38, 39, and 40 was 0.84, 0.91, and 0.89, respectively.

Example 9

Samples 41-43 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), alumina trihydrate (ATH), titanium dioxide, carbon fibers, copper chromite filler (CuCr₂O₄), and glass fibers. Compounding was performed using a 32-mm twin screw extruder. Parts are injection molded the samples into plaques (80 mm × 90 mm × 3 mm).

TABLE 17 41 42 43 LCP 2 19.5 24.5 17.5 LCP 3 5.6 5.6 7.0 LCP 4 17.6 17.6 17.6 ATH 0.5 0.5 0.5 Titanium Dioxide 30 25 30 Glass Fibers 20 20 20 Carbon Fibers 2.4 2.4 3.0 Copper Chromite 4.4 4.4 4.4

Samples 41-43 were tested for thermal and mechanical properties. The results are set forth below in Table 18.

TABLE 18 Sample 41 42 43 Dielectric Constant (2 GHz) 14.3 13.3 16.9 Dissipation Factor (2 GHz) 0.017 0.017 0.019 Melt Viscosity (1,000 s⁻¹) 50 39 49 Melt Viscosity (400 s⁻¹) 81 63 80 DTUL at 1.8 MPa (°C) - - 243 Charpy Notched (kJ/m²) 13 26 14 Charpy Unnotched (kJ/m²) 17 26 14 Tensile Strength (MPa) 125 151 128 Tensile Modulus (MPa) 18,456 17,981 18,768 Tensile Elongation (%) 1.0 1.5 1.0 Flexural Strength (MPa) 174 195 181 Flexural Modulus (MPa) 16,437 15,385 17,288 Flexural Elongation (%) 1.36 1.79 1.36

Samples 41-43 were also subjected to a heat cycle test as described above. Upon testing, it was determined that the resulting dielectric constant for the samples was 14.1, 13.2, and 16.6, respectively. Thus, the ratio of the dielectric constant after heat cycle testing to the initial dielectric constant for Samples 41, 42, and 43 was 0.99, 0.99, and 0.98, respectively. It was also determined that the resulting dissipation factor for the samples was 0.020, 0.020, and 0.021, respectively. Thus, the ratio of the dissipation factor after heat cycle testing to the initial dissipation factor for Samples 41, 42, and 43 was 1.18, 1.18, and 1.10, respectively.

Example 10

Samples 44-47 are formed from various percentages of a liquid crystalline polymer (“LCP 5” and “LCP 3”), wollastonite fibers (Nyglos™ 8), black pigment, carbon fibers, and a lubricant (Glycolube™ P). LCP 5 is formed from 60 mol.% HBA, 5 mol.% HNA, 12% mol.% BP, 17.5 mol.% TA, and 5 mol.% APAP. Compounding was performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (60 mm × 60 mm).

TABLE 19 Sample 44 45 46 47 LCP 5 27.2 37.2 47.2 52.2 LCP 3 21.0 14.0 7.0 3.5 Wollastonite Fibers 30 30 30 30 Black Pigment 12.5 12.5 12.5 12.5 Carbon Fibers 9.0 6.0 3.0 1.5 Lubricant 0.3 0.3 0.3 0.3

Samples 44-47 were tested for thermal and mechanical properties. The results are set forth below in Table 20.

TABLE 20 Sample 44 45 46 47 Surface Resistivity (ohm) 4.20E+15 7.30E+15 1.40E+16 6.40E+15 Volume Resistivity (ohm-m) 5.00E+13 1.60E+14 1.20E+14 9.30E+13 Dielectric Constant (2 GHz) - - 13.1 12.5 Dissipation Factor (2 GHz) - - 0.017 0.018 Notched Charpy (kJ/m²) 7.1 6.7 7.6 8.1 Unnotched Charpy (kJ/m²) 11 18 34 28 Tensile Strength (MPa) 124 127 133 134 Tensile Modulus (MPa) 18,916 16,690 13,067 14,278 Tensile Elongation (%) 1.29 1.5 2.12 1.9 Flexural Strength (MPa) 177 179 166 171 Flexural Modulus (MPa) 18,466 16,180 13,364 14,466 Flexural Elongation (%) 1.59 1.77 2.54 2.21 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 38.3 42.3 40.3 41.8 Melting Temperature (°C, 1^(st) heat of DSC) 319.15 317.2 328.11 325.28 DTUL (1.8 MPa, °C) 235 231 234 233

Samples 46-47 were also subjected to a heat cycle test as described above. Upon testing, it was determined that the resulting dielectric constant for the samples was 12.9 and 12.6, respectively. Thus, the ratio of the dielectric constant after heat cycle testing to the initial dielectric constant for Samples 46 and 47 was 0.99 and 1.0, respectively. It was also determined that the resulting dissipation factor for the samples was 0.021 and 0.015, respectively. Thus, the ratio of the dissipation factor after heat cycle testing to the initial dissipation factor for Samples 46 and 47 was 1.2 and 0.83, respectively.

Example 11

Samples 48-51 are formed from various percentages of a liquid crystalline polymer (“LCP 5” and “LCP 3”), Nyglos™ 8, black pigment, graphite, and Glycolube™ P. Compounding was performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (60 mm × 60 mm).

TABLE 21 Sample 48 49 50 51 LCP 5 27.2 37.2 47.2 52.2 LCP 3 22.5 15.5 7.5 3.75 Wollastonite Fibers 30 30 30 30 Black Pigment 12.5 12.5 12.5 12.5 Graphite 7.5 4.5 2.5 1.25 Lubricant 0.3 0.3 0.3 0.3

Samples 48-51 were tested for thermal and mechanical properties. The results are set forth below in Table 22.

TABLE 22 Sample 48 49 50 51 Surface Resistivity (ohm) 4.10E+16 2.80E+17 1.40E+16 3.50E+16 Volume Resistivity (ohm-m) 1.10E+14 3.50E+14 2.30E+14 7.80E+13 Dielectric Constant (2 GHz) 12.6 8.8 6.3 - Dissipation Factor (2 GHz) 0.0492 0.0201 0.0090 - Notched Charpy (kJ/m²) 4.3 5.3 7.8 12.6 Unnotched Charpy (kJ/m²) 26 30 43 50 Tensile Strength (MPa) 109 132 139 130 Tensile Modulus (MPa) 13491 14737 14562 14229 Tensile Elongation (%) 1.53 1.68 1.96 1.79 Flexural Strength (MPa) 144 167 177 176 Flexural Modulus (MPa) 13689 13858 14259 14091 Flexural Elongation (%) 1.7 2.4 2.54 2.47 Melt Viscosity (Pa-s) at 1,000 s⁻¹ 46.7 45.5 43.5 39.4 Melting Temperature (°C, 1^(st) heat of DSC) 329.28 327.96 330.63 329.94 DTUL (1.8 MPa, °C) 221 228 234 239

Samples 48-50 were also subjected to a heat cycle test as described above. Upon testing, it was determined that the resulting dielectric constant for the samples was 12.6, 8.9, and 6.29, respectively. Thus, the ratio of the dielectric constant after heat cycle testing to the initial dielectric constant for Samples 48, 49, and 50 was 1.0, 1.0, and 1.0, respectively. It was also determined that the resulting dissipation factor for the samples was 0.0578, 0.0214, and 0.0098, respectively. Thus, the ratio of the dissipation factor after heat cycle testing to the initial dissipation factor for Samples 48, 49, and 50 was 1.17, 1.06, and 1.09, respectively.

Example 12

Samples 52-56 are formed from various combinations of liquid crystalline polymers (LCP 2 or LCP 3), alumina trihydrate (ATH), titanium dioxide, carbon fibers, and glass fibers. Compounding was performed using a 32-mm twin screw extruder. Parts are injection molded the samples into plaques (80 mm × 90 mm × 3 mm).

TABLE 23 52 53 54 55 56 LCP 2 33.5 38.5 45.5 50.5 61.5 LCP 3 4.2 4.2 4.8 4.8 3.6 ATH 0.5 0.5 0.5 0.5 0.5 Titanium Dioxide 40 35 30 25 10 Glass Fibers 20 20 20 20 20 Carbon Fibers 1.8 1.8 1.2 1.2 2.4

Samples 52-56 were tested for thermal and mechanical properties. The results are set forth below in Table 24.

TABLE 24 Sample 52 53 54 55 56 Dielectric Constant (2 GHz) 18.3 11.7 8.9 8.9 - Dissipation Factor (2 GHz) 0.014 0.008 0.006 0.007 - Melt Viscosity (1,000 s⁻¹) 77.9 60.1 47.2 40 30.5 Melt Viscosity (400 s⁻¹) 122.8 91.3 68.3 56.9 43.4 DTUL at 1.8 MPa (°C) 272 278 282 285 - Charpy Notched (kJ/m²) - 24 33 - - Charpy Unnotched (kJ/m²) - 24 32 38 - Tensile Strength (MPa) 126 143 152 160 - Tensile Modulus (MPa) 19,791 18,161 16,949 16,962 - Tensile Elongation (%) 1.03 1.49 1.78 1.97 - Flexural Strength (MPa) 182 197 214 207 - Flexural Modulus (MPa) 17,384 16,266 14,517 14,438 - Flexural Elongation (%) 1.48 1.77 2.26 2.39 -

Example 12

Samples 57-58 are formed from various combinations of liquid crystalline polymers (LCP 2, LCP 3, or LCP 4), alumina trihydrate (ATH), titanium dioxide, carbon fibers, copper chromite filler (CuCr₂O₄), and glass fibers. Compounding was performed using a 32-mm twin screw extruder. Parts are injection molded the samples into plaques (80 mm x 90 mm x 3 mm).

TABLE 19 57 58 LCP 2 31.5 39.5 LCP 3 5.6 7.0 LCP 4 - 17.6 ATH 0.5 0.5 Titanium Dioxide 40 10 Glass Fibers 20 20 Carbon Fibers 2.4 3.0 Copper Chromite - 4.4

Sample 58 was tested for thermal and mechanical properties. The results are set forth below in Table 20.

TABLE 20 Sample 58 Dielectric Constant (2 GHz) 9 Dissipation Factor (2 GHz) 0.013 Melt Viscosity (1,000 s⁻¹) 25.2 Melt Viscosity (400 s⁻¹) 38.7 DTUL at 1.8 MPa (°C) 262 Charpy Notched (kJ/m²) 33 Charpy Unnotched (kJ/m²) 36 Tensile Strength (MPa) 162 Tensile Modulus (MPa) 17,232 Tensile Elongation (%) 1.78 Flexural Strength (MPa) 218 Flexural Modulus (MPa) 15,575 Flexural Elongation (%) 2.17

These and other modifications and variations of the present invention may be practiced by those of ordinary skill in the art, without departing from the spirit and scope of the present invention. In addition, it should be understood that aspects of the various embodiments may be interchanged both in whole or in part. Furthermore, those of ordinary skill in the art will appreciate that the foregoing description is by way of example only, and is not intended to limit the invention so further described in such appended claims. 

What is claimed is:
 1. A polymer composition comprising a dielectric material distributed within a polymer matrix, wherein the dielectric material has a volume resistivity of from about 0.1 ohm-cm to about 1 × 10¹² ohm-cmwherein the polymer matrix contains at least one thermotropic liquid crystalline polymer, and further wherein the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.
 2. The polymer composition of claim 1, wherein the composition exhibits a dielectric constant after being exposed to a temperature cycle of from about -30° C. to about 100° C., wherein the ratio of the dielectric constant after the temperature cycle to the dielectric constant prior to the heat cycle is about 0.8 or more.
 3. The polymer composition of claim 1, wherein the composition exhibits a dissipation factor after being exposed to a temperature cycle of from about -30° C. to about 100° C., wherein the ratio of the dissipation factor after the temperature cycle to the dissipation factor prior to the heat cycle is about 1.3 or less.
 4. The polymer composition of claim 1, wherein the composition exhibits a dissipation factor after being exposed to a temperature cycle of from about -30° C. to about 100° C., wherein the ratio of the dissipation factor after the temperature cycle to the dissipation factor prior to the heat cycle is about 1.0 or less.
 5. The polymer composition of claim 1, wherein the dielectric material contains an inorganic oxide material.
 6. The polymer composition of claim 5, wherein the inorganic oxide material includes titanium dioxide particles.
 7. The polymer composition of claim 5, wherein the inorganic oxide material includes inorganic oxide whiskers.
 8. The polymer composition of claim 7, wherein the whiskers are zinc oxide whiskers.
 9. The polymer composition of claim 7, wherein the whiskers have a central body and a plurality of needle crystals extending radially therefrom.
 10. The polymer composition of claim 1, wherein the dielectric material includes an inorganic oxide material having a volume resistivity of from 0.1 ohm-cm to about 500 ohm-cm.
 11. The polymer composition of claim 1, wherein the dielectric material includes a carbon material having a volume resistivity of from about 1 × 10³ to about 1 × 10¹² ohm-cm.
 12. The polymer composition of claim 1, wherein the dielectric material includes an electrically conductive material having a volume resistivity of less than about 0.1 ohm-cm and an insulative material having a volume resistivity of greater than about 1 × 10¹² ohm-cm.
 13. The polymer composition of claim 12, wherein the electrically conductive material includes a carbon material and the insulative material includes an inorganic oxide material.
 14. The polymer composition of claim 13, wherein ratio of the weight percentage of the inorganic oxide material to the weight percentage of the carbon material is from about 3 to about
 100. 15. The polymer composition of claim 1, wherein the thermotropic crystalline polymer is an aromatic polyester that contains repeating units derived from 4-hydroxybenzoic acid.
 16. The polymer composition of claim 1, wherein the thermotropic liquid crystalline polymer has a total amount of repeating units derived from naphthenic hydroxycarboxylic and/or naphthenic dicarboxylic acids of about 10 mol.% or more.
 17. The polymer composition of claim 16, wherein the thermotropic liquid crystalline polymer has a total amount of repeating units derived from naphthalene-2,6-dicarboxylic acid of about 10 mol.% or more.
 18. The polymer composition of claim 1, wherein the polymer composition further comprises a laser activatable additive.
 19. The polymer composition of claim 18, wherein the laser activatable additive contains spinel crystals having the following general formula:

wherein, A is a metal cation having a valance of 2; and B is a metal cation having a valance of
 3. 20. The polymer composition of claim 19, wherein the spinel crystals include MgAl₂O₄, ZnAl₂O₄, FeAl₂O₄, CuFe₂O₄, CuCr₂O₄, MnFe₂O₄, NiFe₂O₄, TiFe₂O₄, FeCr₂O₄, MgCr₂O₄, or a combination thereof.
 21. The polymer composition of claim 1, wherein the polymer composition further comprises a fibrous filler.
 22. The polymer composition of claim 21, wherein the fibrous filler includes glass fibers.
 23. The polymer composition of claim 1, wherein the composition has a melt viscosity of from about 5 to about 100 Pa-s, as determined at a shear rate of 1,000 seconds⁻¹ and a temperature of 350° C.
 24. The polymer composition of claim 1, wherein the composition comprises from about 15 wt.% to about 85 wt.% of thermotropic liquid crystalline polymers and from about 10 wt.% to about 70 wt.% of the dielectric material.
 25. A molded part that comprises the polymer composition of claim
 1. 26. The molded part of claim 25, wherein one or more conductive elements are formed on a surface of the part. 27-37. (canceled) 